This product is a connector designed for M.2 (NGFF) modules, offering a low insertion force (LIF) type. It is manufactured by Japan Aviation Electronics Industry, Ltd. (JAE) and is compliant with NGFF specifications.
Key Features:
Applications: Primarily used in devices incorporating M.2 modules, such as laptops, SSDs, and other compact computing hardware.
| Series | Type | Key Position | No. of Contacts | Contact Finish | Applicable Module Dimension (REF.) | Component Height (MAX) | Pitch | Dimensions (a, b, c, d) | Manufacturing Code |
|---|---|---|---|---|---|---|---|---|---|
| SM3 | Z: LIF Type | A, B, E, M | 74 | A: Au(0.13m MIN), B: Au(0.25m MIN) | 310: 3.10mm, 410: 4.10mm, 215: 2.15mm | 4.70 mm | 0.5 mm | a: 1.5mm, b: 1.55mm, c: 1.2mm, d: 0.5mm | SM3ZS067U410 |
| Part | Material | Finish | Quantity | Remarks |
|---|---|---|---|---|
| HOLD DOWN | COPPER ALLOY | TIN PLATING OVER NI | 2 | |
| TOP SIDE CONTACT | COPPER ALLOY | CONTACT AREA: REFER TO DESIGNATION, SOLDERING AREA: Au FLASH OVER Ni | 34 | |
| BOTTOM SIDE CONTACT | COPPER ALLOY | CONTACT AREA: REFER TO DESIGNATION, SOLDERING AREA: Au FLASH OVER Ni | 33 | |
| INSULATOR | THERMO PLASTIC INDUSTRY,LTD. | 1 |
| Dimension | Tolerance | Unit |
|---|---|---|
| General Tolerance | 0.1 | mm |
| Angles | 5 | degrees |
| Coplanarity of Contact and Hold Down | 0.1 MAX | mm |
| Ejector Pin Mark Area (No Burrs) | N/A | mm |
