This section provides a recommended PCB layout example for the product, including details on layer configurations, dimensions, and plating specifications. It is intended as a guide for implementation.
FR4
0.8 mm
0.035 mm
0.5 - 2.5 mm
M2 x 0.4
Details on the packing units and tray configurations for the product.
2.0 mm (Min.)
25 pcs/box
70 pcs
4 trays (some fraction trays exist)
This section details the materials and finishes used for different components, including their respective remarks.
| No. | Material | Finish | Remarks |
|---|---|---|---|
| 1 | ZINC ALLOY NICKEL PLATING | ||
| 2 | BERYLLIUM COPPER | GOLD PLATING |
| SCALE | COUNT | DESCRIPTION OF REVISIONS | DESIGNED | CHECKED | DATE | APPROVED | DATE | DRAWING NO. | REVISON |
|---|---|---|---|---|---|---|---|---|---|
| 200 | 1 | pIs-p-00001222 | XY. SHIMIZU | 16.05.91 | KY. SHIMIZU | 16. 03. 04 | EDC-368283-00-00 | [A[1] | |
| K. HIROSE | BNCC75)-PLR-PC-126-1 | ||||||||
| YT. FUNADA | 18. 03. 04 | E1302-0083-0-00 |
