This document outlines specifications for a tin-lead plated area, detailing requirements for bright tin-lead plate area over nickel (Ni) or copper (Cu) substrates. It specifies minimum thickness requirements for the tin-lead layer and underlying nickel plating, along with localized plate area requirements.
| Specification | Min Thickness (in) | Min Thickness (m) |
|---|---|---|
| Bright Tin-Lead Plate Area Over Nickel (Ni) | 150 | 3.81 |
| Bright Tin-Lead Plate Area Over Copper (Cu) | 150 | 3.81 |
| Nickel Underplate (for Tin-Lead Plate) | 100 (localized) | 2.54 (localized) |
| Localized Tin-Lead Plate Area Over 0.00130" Min Nickel | 150 | 3.81 |
| Localized Tin-Lead Plate Area Over 0.00094" Min Nickel | 120 | 3.05 |
| Localized Tin-Lead Plate Area Over 0.00071" Min Nickel | 100 | 2.54 |
| Specification | Min Thickness (in) | Min Thickness (m) |
|---|---|---|
| INSULATION TRANSGE: 1.50 [0.059] DA | 150 | 3.81 |
| INSULATION TRANSGE: 2.33 [0.094] DA | 233 | 5.92 |
