This specification covers performance, tests, and quality requirements for D-sub right angle and vertical printed circuit board mounted connectors. Applicable product descriptions and part numbers are as shown on the product drawing.
| Specification | Requirement | Procedure |
|---|---|---|
| Initial examination of product | Meets requirements of product drawing. | Visual inspection per product drawing. Per EIA-364-18 |
| Final examination of product | Meets visual requirements. | Visual inspection per product drawing. Per EIA-364-18 |
| Low Level Contact Resistance | 25 m max. for 30 pin gold plated product. 30 m max. for 15 pin and gold flash plated product. | Per EIA 364-23. Subject mated contacts assembled in housing to 20 mV open circuit at 100 mA maximum. |
| Dielectric Withstanding Voltage | No creeping discharge or flashover shall occur. Leak current: 1mA Max. | Per EIA 364-20 Apply 1000V AC for 1 minute at sea level at adjacent contacts and between contacts and metal shell of unmated connector assemblies. |
| Insulation Resistance | 5000 M minimum initial. 1000 M minimum final. | Per EIA 364-21. 500V DC for 1 minute, test between adjacent contacts of unmated connector assemblies |
| Temperature Rise | 30C maximum temperature rise at specified current. | EIA 364-70 Measure temperature rise vs current. All positions series wired individually forming a single circuit in each connector. Rated current when all contacts are loaded |
| Vibration, Random | No discontinuities greater than 1 microsecond. | Per EIA 364-28, condition V, test letter F Duration 15 minutes. 15 minutes in each of three mutually per planes. |
| Physical Shock | No discontinuities greater than 1 microsecond. No physical damage. | Per EIA 364-27 Subject mated connectors to 50 G's half-sine shock pulses of 11 milliseconds duration. 3 shocks in each direction applied along 3 mutually perpendicular planes, 18 total shocks. |
| Mating Force | 150N max. | Per EIA 364-13. Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. |
| Unmating Force | 150N max. | Per EIA 364-13. Measure force necessary to unmate connector assemblies at rate of 1 inch per minute. |
| Durability | See note. | Per EIA 364-09 Mate and unmate connector assemblies for 100 cycles for gold flash and 15pin gold plating , 500 cycles for 30 pin gold plating at maximum rate of 200 cycles per hour. |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Per EIA 364-52 For wave soldering Temperature: 245C5C Immersion duration : 5 seconds After 1 hour 5 minutes steam aging |
| Thermal Shock | See note. | Per EIA 364-32, test condition VII Subject mated connectors to 5 cycles Between -55C and +105C with each cycle consisting of 30 minute dwells at -55 and 105C. The transition between temperatures was less than 5 minutes. |
| Humidity | See note. | Per EIA 364-31 Method II test condition A Subject mated connectors to 96 hours at 40C with 90% to 95% RH. |
| Temperature Life | See note. | Per EIA 364-17 test condition IV Method A Subject mated connectors to temperature life at 105C for 500 hours. |
| Salt Spray | See note. | Per EIA 364-26 Mated connector Salt concentration: 5%, 352 C, 8 hours |
