This product information details various plating specifications and material requirements for connector components. It outlines specific plating thicknesses, materials, and application areas, including tin-lead, tin, nickel, and gold plating, along with their respective standards and tolerances. The information is intended for manufacturing and quality control purposes in the electronics industry.
| Description | Plating Material | Thickness (m) | Thickness (inch) | Standard | Notes |
|---|---|---|---|---|---|
| Main Tin or Tin-Lead Cover | Tin-Lead | 1.27 | .000050 | MIL-T-10727 | |
| Gold Flash Over Nickel | Gold | 0.27 | .000010 | MIL-G-45204 | On mating end |
| Nickel Underplate | Nickel | 1.20 | .000047 | Under Gold Flash | |
| Tin Plating | Tin | 2.54 | .000100 | MIL-T-10727 | |
| Nickel Plating | Nickel | 2.50 | .000100 | ||
| Gold Plating | Gold | 0.76 | .000030 | MIL-G-45204 | For mating end |
| Tin Plated Wire Barrels | Tin | 0.75 | .000030 | ||
| Nickel Underplate | Nickel | 0.76 | .000030 | Under Tin | |
| Nickel Underplate | Nickel | 0.76 | .000030 | Under Gold | |
| Gold Plating | Gold | 2.54 | .000100 | MIL-G-45204 | For mating end |
| Tin Plating | Tin | 2.54 | .000100 | MIL-T-10727 | For mating end |
| Nickel Underplate | Nickel | 1.27 | .000050 | Under Tin |
