This document outlines specifications for packing, marking, and technical details related to electronic components. It covers aspects like lot marking, carrier tape packing, cover tape peeling force, and various inspection criteria. Specific details on product series, part numbers, and descriptions are provided for different components.
| Item | Description | Remarks |
|---|---|---|
| Lo-planarity Sense | 0.03max before reflow, 0.03max after reflow 2 times | |
| Lot Marking | 5 digits (MOQ C) | |
| Carrier Tape Packing | ||
| Packing Quantity | 1400 PCS / REEL | |
| Cover Tape Peeling Force | 19~130 gf (1~13 N) @ 300mm/min | |
| Conductors | Pes: LESLER 68 v Fin | |
| Pickup Area | ||
| Terminal | D S30n|vous | |
| AMN Series | Varking |
| Part No. | Description | Revision | Date |
|---|---|---|---|
| RE-2-2440 | Released | KYG | 23.10.26 |
| RE-2-2477 | EC | Ko | 2.12.08 |
| RE-2-2556 | EC | Osw | 24.8.5.01 |
| Part No. | Hole | Check | Release | Date |
|---|---|---|---|---|
| DC3-633 F | 154 | HJLEZ | HILZE | 0824 |
| DC3-63375 | 154 | HJLEZ | HILZE | 0824 |
| Part | Material | Finish | Remarks |
|---|---|---|---|
| CONTACT AREA | COPPER ALLOY | NICKEL PLATING | |
| SOLDER AREA | GOLD OVER NICKEL PLATING | ||
| CONTACT | COPPER ALLOY | OTHER AREA : NICKEL PLATING | |
| THERMO-COMPRESSION SEALING | BLACK COLOR |
| Part No. | Description | Hole | Check | Release | Date |
|---|---|---|---|---|---|
| DC3-633 F | (L G2F-000R3-000 PG) | Air leak Full inspection | |||
| DC3-63375 | (CL 6247-0003- P65) | Air leak Full inspection |
