This document details the specifications for the 16XN-4XSD78 series, a USB Type-C connector designed for various electronic applications. It outlines material specifications, plating details, mechanical and electrical performance, and environmental considerations.
| Specification | Details |
|---|---|
| Plating Specification (Contacts) | Ni 50" MIN. Under Plated Over All. Au Plated on the functional area of contact. Gold flash plating on solder area. (Gold plating thickness follows P/N) |
| Plating Specification (Shell) | Ni 30" MIN. Under Plated Over All. |
| Insertion Force | 0.5 ~ 2.0 kgf |
| Removal Force | 0.8 kgf ~ 2.0 kgf |
| Durability | 10,000 Cycles |
| Current Rating | 5A |
| Voltage Rating | 20V |
| Insulation Resistance | 100M MIN. |
| Dielectric Withstand Voltage | AC 100V for 1 minute |
| Low Contact Resistance (Initial) | 40m |
| Low Contact Resistance (After) | 50m |
| Operating Temperature | -30C ~ +80C |
| Reflow Specification | Peak temperature on board maintained for 10 seconds at 260C |
| Pin Number | Signal Name | Pin Number | Signal Name |
|---|---|---|---|
| A1 | SBU1 | B1 | SBU2 |
| A2 | CC1 | B2 | CC2 |
| A3 | D+1 | B3 | D-2 |
| A4 | D-1 | B4 | D+2 |
| A5 | VBUS | B5 | VBUS |
| A6 | VBUS | B6 | VBUS |
| A7 | D+2 | B7 | D-1 |
| A8 | D-2 | B8 | D+1 |
| A9 | SBU2 | B9 | SBU1 |
| A10 | GND | B10 | GND |
| A11 | B11 | ||
| A12 | B12 |
