The ExaMAX High-Speed Backplane System offers a robust solution for high-speed data transmission, designed for demanding applications. Featuring a staggered differential pair design with reliable two-point contact and a 2.4 mm wipe, it ensures signal integrity. The shielded wafer design minimizes crosstalk, and the system supports PCIe 6.0/CXL 3.1 capabilities. Available in various pair and column configurations, it meets and exceeds industry specifications like OIF CEI-28G-LR. The system is compatible with ExaMAX High-Speed Backplane Cable Assemblies, which utilize Eye Speed Ultra Low Skew Twinax Cable for improved signal integrity and routability, offering modular flexibility and cost reduction through lower layer counts. An Eye Speed Thinax ultra performance twinax cable version is in development.
| Series | Insulator Material | Contact Material | Plating | Operating Temp Range | Current Rating | Voltage Rating | Lead-Free Solderable | Pitch |
|---|---|---|---|---|---|---|---|---|
| EBTM/EBTF/EBDM | Liquid Crystal Polymer | Copper Alloy | Sn or Au over 50 " (1.27 m) Ni | -55 C to +105 C | 4 A per pin | 150 VAC | Yes | 2.00 mm (.0787") |
| EPTT/EPTS | High Temperature Thermoplastic | Copper Alloy | Sn or Au over 50 " (1.27 m) Ni | -55 C to +105 C | 14.1 A per pin | 150 VAC | Yes | 2.00 mm (.0787") |
| EBCM/EBCF | Liquid Crystal Polymer | Copper Alloy | Au over 50 " (1.27 m) Ni | -40 C to +105 C | 3.6 A per pin | 125 VAC | N/A | 2.00 mm (.0787") |
