PANASONIC AXE610124D

Safety Remarks and Usage Guidelines for Narrow Pitch Connectors

To prevent accidents and injuries, it is crucial to adhere to the following safety remarks and usage guidelines. Using these connectors beyond their specified limits, including rated current, dielectric strength, and environmental conditions, may lead to circuitry damage through abnormal heating, smoke, or fire. A thorough review of specifications is appreciated; please contact a sales representative for usage outside of these specifications. Panasonic Industry Co., Ltd. cannot guarantee quality and reliability for such cases.

Electrical components generally have a statistical probability of failure, and their durability varies with use environments. It is recommended to check actual electrical components and devices under actual conditions before use. Continued usage in a degraded state can lead to deteriorated insulation, resulting in abnormal heat, smoke, or fire. Implement safety designs, including redundancy, fire spread prevention, and malfunction prevention, to avoid accidents that could cause injury, death, fire, or social damage.

Regarding the Design of Devices and PC Board Patterns

• When using board-to-board connectors, do not connect a pair of boards with multiple connectors. Misaligned positions can cause mating failure or product breakage.
• When mounting equipment, allow for positioning errors of up to 0.2 to 0.3 mm. Design PC boards and patterns considering the performance of the required equipment.
• If connectors have embossed tabs for positioning, ensure the PC board has matching positioning holes.
• To ensure mechanical strength during soldering, adhere to the recommended PC board pattern design dimensions.
• Minimize the thickness of cover lay and adhesive to prevent poor soldering, as these connectors have no stand-off.
• For narrow pitch series connectors, design means to fix the PC board in place to prevent it from coming off during vibrations or impacts, and to prevent loads from falling directly on soldered portions. Examples include securing with screws and spacers.

When Mounting Connectors on a FPC

• To prevent solder detachment from terminals during mating or unmating, reinforcing plates are recommended on the backside of the FPC where the connector is mounted. The plate should be larger than the recommended PC board pattern.
• Due to the temporary locking structure, FPC size, weight, or bending force can cause mating separation upon impact. Consider measures to prevent this.
• These connectors are designed to be compact and thin. Handle with care during mating to prevent damage or deformation caused by displacement or angled mating.

Regarding the Selection of the Connector Placement Machine and Mounting Procedures

• Select placement machines considering connector height, positioning accuracy, and packaging conditions.
• Avoid excessive chucking force from the placement machine, which can deform the connector body or terminals.
• Be aware that external forces during mounting can cause deformations to contact surfaces and terminals.
• For larger connectors, self-alignment may not be possible; carefully position the terminal with the PC board pattern.

Regarding Soldering

Reflow Soldering

• Measure recommended profile temperatures with a sensor on the PC board near the connector.
• Screen printing is recommended for cream solder printing. Refer to specifications for screen opening area and PC board foot pattern area.
• Avoid excessive solder to prevent miss mating due to interference at the soldering portion.
• When mounting on the underside of a PC board, use adhesives or other means to fix the connector. Double reflow soldering on the same side is possible.
• Consider solder and flux characteristics and set reflow temperature and oxygen levels accordingly.
• Positioning bosses offer approximate alignment; use an automatic positioning machine for accurate mounting.
• In dry conditions, static electricity can cause products to adhere to carrier tape. Recommended humidity is 40-60% RH; use an ionizer to remove static electricity.
• Do not use resin-containing solder, as it may fix contacts firmly.

Soldering Conditions

Use the recommended reflow temperature profile. Contact a sales representative for profiles other than those described (e.g., lead-free solder). Profiles are measured on resin-based PC boards; check for deformation or discoloration when reflow soldering on metal boards or tables.

Hand Soldering

• Set soldering iron tip temperature below the values specified in Table A (300C within 5 sec. for SMD type connectors, 350C within 3 sec. for all products).
• Prevent flux from spreading onto connector leads or PC boards to avoid flux rising into the connector.
• Heat the foot pattern and connector terminal before applying solder wire.
• Avoid applying load to connector terminals during soldering.
• Thoroughly clean the soldering iron.
• After soldering, check and clean any solder from contact surfaces.
• For low profile connectors, avoid excessive solder to prevent miss mating.

Solder Reworking

• Finish reworking in one operation.
• Do not use supplementary solder flux for rework of bridges, as it may cause contact problems.
• Keep soldering iron tip temperature below the specified limits.

Handling Single Components

• Do not drop or allow parts to fall.
• Handle with care to prevent warping, detachment, or weakening of solder adhesion due to excessive force on terminals.

Precautions for Mating

• Take care to prevent deformation or damage to contacts and molding. Do not mate connectors as shown in the diagrams (pressing while inlets are not matched, strongly pressed and twisted, tilted mating).
• Avoid reverse insertion, as it may cause circuitry damage.

Cleaning Flux from PC Board

• No cleaning is required for this product.
• If cleaning is necessary, keep cleaning solvent clean and prevent contamination of connector contacts.
• Use pure water passed liquid solvent, as some strong solvents may dissolve molded parts.
• Do not insert or remove the connector when it is not soldered.