TE Connectivity / ERNI 024070

Product Overview

The solderless pressfit technique is increasingly utilized in electronic and electrical equipment due to packaging miniaturization and higher packing densities. ERNI's compliant pressfit zone offers a reliable connection between the PC Board and the connector. ERNI provides a comprehensive pressfit range for all connector types, including right-angled pressfit connectors for daughter cards. The pressfit zone is engineered to engage with the copper layer of a PCB's plated-through hole, penetrating the tin plating to create a gas-tight, corrosion-free contact with low electrical resistance. These connectors are integral to modern electronic packaging bus systems, connecting assemblies and their power supplies. As plug-in modules become more powerful, demands on bus systems increase, making them crucial for control systems due to higher system speeds and shrinking connection structures. Pressfit termination enables the use of more powerful electro-mechanical components. ERNIPRESS solderless pressfit connectors are suitable for applications where PC Board structures cannot withstand harsh automated soldering processes.

For DIN connectors, ERNI uses two pressfit zones: EE-zone (boat contour) and EN-zone (eye of the needle). Both require identical PCB hole specifications as described in IEC 60352-5.

Key Factors for Pressfit Connector Performance:

• PCB Base Material: Epoxy glass fabric type Hgw 2372.1 to DIN 7735, FR 4, is recommended for UL requirements.
• Drillhole Tolerances: Adherence to tolerances for optimum and uniform plating.
• Drillhole Diameter, Positioning, and Tolerances: Maintaining correct drillhole wall roughness and restricting drill bit travel are critical.
• PCB Hole and Layout Requirements: Minimal residual ring width (0.1 mm), finished hole diameter tolerances, layer thicknesses, and high-quality conductive patterns are essential.
• Insertion and Retention Forces: These forces should be measured and checked.

The ERNIPRESS pressfit zone design offers high elasticity to accommodate large hole tolerances and ensures high edge loading at the PCB copper layer for a gas-tight, corrosion-free, and mechanically secure connection. Insertion forces do not detrimentally affect the hole plating. Retention forces are sufficient for wire wrap termination, with typical average values ranging from 50-110 N per contact, depending on PCB thickness.