Subminiature, LAN Modular Jack Connectors designed for Fast Ethernet (100BASE-TX) transmission, complying with TIA/EIA-568-B data wiring requirements. These connectors offer a subminiature design that contributes to significant space-saving within equipment. They feature built-in light indicators which eliminate the need for separate space allocation and do not emit electrical noise. Enhanced EMI protection is provided by metal shield covers. The product is environmentally conscious with lead-free plating and meets FCC standards (Title 47, Part 68, Subpart F). A Through-Hole Mounting (THR) compatible type is also available.
LAN Equipment, Office Equipment, and Measuring Devices.
| Series | Connector Type | Number of Positions | Shielding | Mounting Type | Height (max) | Width (max) | Depth (max) |
|---|---|---|---|---|---|---|---|
| TM11R-5M2 | Modular Jack | 8 pos. | Yes (Metal shield) | Through-Hole | 11.5 mm | 15 mm | 17.5 mm |
| Feature | Description |
|---|---|
| Fast Ethernet Support | Complies with TIA/EIA-568-B, supports Cat.5 transmission for 1,2-3,6 conductor pairs (100BASE-TX). |
| Built-in Light Indicators | Integrated into the connector, space-saving, no electrical noise emission. |
| EMI Protection | Metal shield covers outer surfaces. |
| Recommendation | Details |
|---|---|
| PCB Mounting Patterns | Specific areas recommended to be free of conductive traces and ground traces. Recommended board thickness: 1.6mm. LED mounting area and light emission area dimensions provided. |
| Panel Cutout | Recommended cutout dimensions for various types. Notch for lock lever relief. Panel mounting position relative to PCB mounting surface. Contact spring position from connector front surface. |
| Cleaning | IPA cleaning at room temperature recommended. Caution with aqueous cleaning agents due to potential color change of light pipe (polycarbonate resin). |
| Soldering (Through-Hole) | Recommended for flow solder and hand soldering. Specific pre-heat, soldering temperatures, and times provided. Recommended solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu. Temperature profile for reflow cycles. |
