This document details TE Connectivity's 8-position SMT modular jacks, designed for surface mount technology (SMT) applications. These connectors are available in various configurations and colors, including black and yellow, with options for standard and inverted mounting. They are suitable for automated pick-and-place assembly and meet specific product requirements for plating and material.
| Part Number | Description | Housing Material | Housing Color | Contact Material | Shield Material | Plating (Contact) | Plating (Solder Zone) | Plating (Mating Zone) | PCB Layout | Application |
| 1705549-1 | MODULAR JACK SMT, 8 POSITION, BLACK | 30% G.F. LCP | BLACK | PHOSPHOR BRONZE | TINPLATED BRASS | Ni 1.27m MIN. OVERALL | Sn 3.5-5.0m | CONFIRMS TO PRODUCT REQUIREMENTS AS PER SPECIFICATION 108-19117 | RECOMMENDED PCB-LAYOUT INVERTED APPLICATION | SMT |
| 1705549-2 | MODULAR JACK SMT, 8 POSITION, YELLOW | 30% G.F. PA 4T | YELLOW | PHOSPHOR BRONZE | TINPLATED BRASS | Ni 1.27m MIN. OVERALL | Sn 3.5-5.0m | CONFIRMS TO PRODUCT REQUIREMENTS AS PER SPECIFICATION 108-19117 | SEE NOTE 2 | SMT |
| 1705549-3 | MODULAR JACK SMT, 8 POSITION, BLACK | 30% G.F. PA 4T | BLACK | PHOSPHOR BRONZE | TINPLATED BRASS | Ni 1.27m MIN. OVERALL | Sn 3.5-5.0m | CONFIRMS TO PRODUCT REQUIREMENTS AS PER SPECIFICATION 108-19117 | SEE NOTE 3 | SMT |
