This document details technical specifications and manufacturing notes for a Hirose connector series. It includes information on mating parts, PCB layout guidelines, material finishes, and packaging details. The series conforms to USB2.0 specifications and maintains good performance even with minor surface imperfections.
| No. | MATERIAL | FINISH | REMARKS |
|---|---|---|---|
| 1 | COPPER ALLOY | GOLD 0.75m min. (CONTACT AREA) | |
| NICKEL 2m min. (UNDER PLATING) | |||
| 2 | COPPER ALLOY | TIN 1m min. | |
| 3 | STAINLESS STEEL | PLATING |
| NOTES | CO-PLANARITY | PLATING | LEAD AREA | UNDER PLATING | PACKING | INTERFACE DIMENSIONS | PERFORMANCE | PLATING LUSTER | SHAPE DIFFERENCE |
|---|---|---|---|---|---|---|---|---|---|
| 1 | WITHIN 0.08 | GOLD 0.75m min. | GOLD 0.05m min. | NICKEL 2m min. | 3500 pcs | CONFORM TO USB2.0 SPECIFICATION | REMAINS GOOD EVEN WITH RUBBING WOUNDS | GOOD THOUGH MIGHT BE DIFFERENCE BETWEEN SUBCONTRACT COMPANIES | MAY BECOME DIFFERENT DEPENDING ON PRODUCTION METHOD |
| YEAR | MONTH | DAY | LINE No. |
|---|---|---|---|
| 2007 | Jan [A] | 1 [B] | 0 [W] |
| 2008 | Feb [B] | 2 [C] | 1 [X] |
| 2009 | Mar [C] | 3 [D] | 2 [Y] |
| 2010 | Apr [D] | 4 [E] | 3 [Z] |
| 2011 | May [E] | 5 [F] | 4 [0] |
| 2012 | Jun [F] | 6 [G] | 5 [1] |
| 2013 | Jul [G] | 7 [H] | 6 [2] |
| 2014 | Aug. [H] | 8 [I] | 7 [3] |
| 2015 | Sep [I] | 9 [J] | 8 [4] |
| Oct. [J] | 10 [K] | 9 [5] | |
| Nov. [K] | 11 [L] | ||
| Dec. [L] | 12 [M] |
