Function & Usage: Provides the interface for Super Speed up to 5 Gbps data rate, fully compliant with USB2.0 & 3.0 specifications. Designed for SMT process with high temperature plastic and Halogen Free solution. Features 5 metal friction lock grounding fingers and polarization plastic design for plug retention, along with two fork lock hold-downs for mounting force. Offers full metal shielding for EMI/RFI/ESD protection.
Advantages:
Application Scenarios: Suitable for applications requiring high-speed data transfer and robust connectivity.
| Part No | Packaging | Plating | Durability Class | Mechanical Insertion Force | Mechanical Extraction Force | Electrical Voltage | Electrical Current (Pin 1 & 4) | Electrical Current (Other Pins) | Contact Resistance (Pin 1 & 4) | Contact Resistance (Other Pins) | Dielectric Withstanding Voltage | Insulation Resistance | Impedance |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GSB311131HR | Tray | 30 " Gold | High Durability | 35.0N max. | 8.0N min. | 30.0 VA | 1.8A | 0.25A min. | 30m Max. | 50m Max. | 100 VAC | 100M min. | 90+/-15 @ 50 ps rise time (20%~80%) |
| GSB311111HR | Tray | Gold Flash | Standard Durability | 35.0N max. | 8.0N min. | 30.0 VA | 1.8A | 0.25A min. | 30m Max. | 50m Max. | 100 VAC | 100M min. | 90+/-15 @ 50 ps rise time (20%~80%) |
| Material - Housing | Material - Spacer | Material - Terminal | Material - Shell | Durability Cycles (Standard) | Durability Cycles (High) |
|---|---|---|---|---|---|
| 94V-0 high temperature thermoplastic, with 30% GF | 94V-0 high temperature thermoplastic, with 30% GF | Phosphor Bronze | Copper Alloy | 1500 cycles min. | 5000 cycles min. |
