The M.2 (Next Generation Form Factor) product line is a smaller form factor transition from Mini Card and Half Mini Card, supporting multiple function add-in cards/modules including WiFi, Bluetooth, GNSS, NFC, Hybrid Digital Radio, WiGig, WWAN, and Solid-State Storage Devices. It integrates functionality from PCIe Gen 3, SATA 3, SATA I/O, and USB 3, making it suitable for thin platforms. Key benefits include significant PCB real estate savings (over 20% compared to PCIe Mini Card), reduced connector height (15%), and support for higher data rates.
TE Connectivity
M.2 (NGFF)
0.5mm
67
Supports single and double-sided modules
Available in various keying options
PCI Express 3.0, USB 3.0, SATA 3.0
| Part Number Base | Max. Height (mm) | Nominal Height (mm) | Dim. A (mm) | Dim. B (mm) | Dim. C (mm) | Double Sided Modules | Gold Plating |
|---|---|---|---|---|---|---|---|
| 2199125-X | 2.25 | 2.15 | 1.08 | 0.63 | N/A | No | Gold Flash |
| 2199119-X | 3.2 | 3.1 | 1.94 | 1.48 | N/A | Yes | 15u |
| 2199230-X | 4.2 | 4.1 | 2.94 | 2.48 | N/A | Yes | 30u |
| Key ID | Pin Interface | Width (mm) | Length (mm) | Component Max Ht. (mm) |
|---|---|---|---|---|
| A | 2x PCIe x1/USB 2.0/12C/DP x4 | 12 | 16 | 1.20 (T) |
| B | PCIe x2/SATA/USB 2.0/USB 3.0/ HSIC/SSIC/Audio/UIM/I2C | 16 | 26 | 1.35 (T) |
| E | 2x PCIe x1/USB 2.0/IC2/SDIO/ UART/PCM | 22 | 30 | 1.50 (T) |
| M | PCIe x4/SATA | 30 | 42 | 1.20 (D1) |
| Specification | Rating | Unit | Initial | Final |
|---|---|---|---|---|
| Rated Voltage | 50 | VAC (per pin) | N/A | N/A |
| Rated Current | 0.5 | A (per pin) | N/A | N/A |
| Service Temperature | -40 ~ +80 | C | N/A | N/A |
| Contact Resistance | 55 Max / 20 Max Change | m Ohm | 55 m Ohm | 20 m Ohm |
| Dielectric Withstanding Voltage | N/A | N/A | N/A | N/A |
| Insulation Resistance | 500 Min | M Ohm | 500 M Ohm | 500 M Ohm |
| Current Rating | 30C Max Change | N/A | N/A | N/A |
| Mating Force | 20 Max | N | N/A | N/A |
| Unmating Force | 25 Max | N | N/A | N/A |
| Durability | 60 | Cycles | N/A | N/A |
| Durability (Preconditioning) | 5 | Cycles | N/A | N/A |
| Vibration | No discontinuity > 1u sec | N/A | N/A | N/A |
| Mechanical Shock | No discontinuity > 1u sec | N/A | N/A | N/A |
| Humidity - Temperature Cycle | 20 Max Change | m Ohm | N/A | 20 m Ohm |
| Thermal Shock | 20 Max Change | m Ohm | N/A | 20 m Ohm |
| Temperature Life | 20 Max Change | m Ohm | N/A | 20 m Ohm |
| Thermal Disturbance | 20 Max Change | m Ohm | N/A | 20 m Ohm |
| Resistance to Reflow Soldering Heat | No damage | N/A | N/A | N/A |
