This product appears to be related to electronic component mounting and routing, specifically for cards. It details areas for hold-down solutions, component placement, and general layout considerations. The information suggests guidance for PCB design and assembly, focusing on the physical arrangement and support of components and cards.
| Part/Model | Width (mm) | Length (mm) | Component Area (Top Side) (mm) | Component Area (Bottom Side) (mm) | Hold Down Solution Area (mm) | Min. Clearance (mm) | Max. Card Thickness (mm) |
|---|---|---|---|---|---|---|---|
| Full-Mini Card (Top & Bottom) | 42 | - | 48 | 48 | 50 | 5 | - |
| Half-Mini Card | 38.5 | 135 | - | - | 45.5 | 5 | 0.254 |
| Full Card | - | - | - | - | - | 0.5 | - |
| Detail | Scale | Notes |
|---|---|---|
| Detail L | 5:1 | All critical areas are across plating and/or metallization. A level must be present and drill of 1mm from PCB pad for solder materials. |
| Detail K | 5:1 (Bottom Side) | Includes cutting. |
