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VISHAY EB43-S3R066FS

Brand Name: EB43-S3R066FS
Model Number: EB43-S3R066FS
Minimum Order Quantity: 2
Packaging Details: Through Hole,P=2.54mm
Delivery Time: 12-16工作日
Stock: 43
Description: 2.54mm 12P Through Hole,P=2.54mm Edgeboard Connectors
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Specifications
Pitch:
2.54mm
Contact Material:
Phosphor Bronze
Operating Temperature:
-65℃~+125℃
Number Of Pins:
12P
Product Description

Product Overview

Vishay Dale EB4 Edgeboard Connectors, Dual Readout, feature a 0.100" (2.54 mm) center-to-center contact spacing and are designed for use with 0.0625" (1.59 mm) printed circuit boards. These connectors offer greater design latitude with options for glass-filled polyester and polyphenylene sulfide body materials, standard and right-angle terminals, and multiple body sizes and mounting styles. They accept PC board thicknesses from 0.054" to 0.071" (1.37 mm to 1.80 mm) and provide polarization between contact positions. Applications include edgeboard connections on 0.100" (2.54 mm) centers for printed circuit boards.

Product Attributes

  • Brand: Vishay Dale
  • Contact Spacing: 0.100" (2.54 mm)
  • Body Materials: Glass-filled polyester, Glass-filled polyphenylene sulfide
  • Contact Material: Phosphor bronze
  • Polarizing Key Material: Glass reinforced nylon
  • Plating: Selective gold plating
  • Certifications: Flame retardant (UL 94 V-0 for polyester, UL 94H-B for nylon)

Technical Specifications

Specification Details
Electrical Specifications
Current Rating 3 A
Test Voltage (at sea level) 650 VRMS
Test Voltage (at 70,000 ft) 275 VRMS
Insulation Resistance 5000 M minimum at 500 VDC
Contact Resistance 30 mV maximum at rated current (with gold plating)
Operating Temperature -65 C to +125 C
Humidity Resistance Insulation resistance > 5000 M after 96 h at 90% RH at +40 C, dried for 3 h
Durability Contact resistance < 0.030 V at 3 A after 500 cycles; contact pair separation force > oz.
Shock Resistance No loss of continuity after three 50G shocks in 3 planes
Vibration Resistance No loss of continuity after 2 h in 3 planes (10 cps to 55 cps at 0.06 double amplitude)
Physical Specifications
Contact Type Bifurcated cantilever beam
Number of Contacts per Side 6, 10, 12, 15, 18, 20, 22, 25, 28, 30, 31, 35, 36, 40, 43, 44, 48, 49, 50, 60, 65
Contact Terminal Variations Standard: C (dip solder, 0.175" length), D (dip solder, 0.115" length), K (Wire Wrap, 0.570" length)
Right Angle: 1R (0.150" row spacing, 0.120" length), 2R (0.200" row spacing, 0.120" length), 3R (0.150" row spacing, 0.180" length), 4R (0.200" row spacing, 0.180" length)
Contact Terminal Row Spacing Standard: 0.200" (5.08 mm) nominal
Right Angle: 0.150" (3.81 mm) nominal, 0.200" (5.08 mm) nominal
PC Board Thickness Acceptance 0.054" to 0.071" (1.37 mm to 1.80 mm)
Card Slot Depth 0.300" (7.62 mm)
Grid Patterns 0.100" C-C x 0.150" (2.54 mm x 3.81 mm), 0.100" C-C x 0.200" (2.54 mm x 5.08 mm)
Mounting Styles X (Clearance Hole, Raised Flange), XF (Clearance Hole, Flush Flange), XS (Right Angle Flange), XFS (Right Angle Flush Flange), W (No Flange), YF (Threaded Insert, Flush Flange), Y (Threaded Insert, Raised Flange)
Plating Details SG: 0.00003" (0.000762 mm) min. gold on contact area, gold flash on terminal.
SGF: 0.000010" (0.000254 mm) min. gold on contact area, gold flash on terminal.
All gold plating over 0.00005" (0.00127 mm) min. nickel underplate.
Dimensions (example for 6 contacts per side)
A 1.435" (36.45 mm)
B 1.175" (29.85 mm)
C 0.700" (17.78 mm)
D 0.860" (21.84 mm)
E 0.750" (19.05 mm)
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