This document outlines the specifications and details for a receptacle assembly, specifically a right-angle flag type with 4 positions. It details material, plating, and mounting dimensions for PC board integration.
| Part Number | Description | Housing Material | Contact Material | Plating | PC Board Thickness (Recommended) | Mounting Type | Position | Dimensions (L x W) |
|---|---|---|---|---|---|---|---|---|
| 31007 | Receptacle Assembly, Right Angle Flag, 4 Position | LCP, UL 94V-0, Black | Phosphor Bronze | Contacts: 0.076 um Min Gold over 0.076 um Min Palladium-Nickel on Mating Area, 3.8 um Min Matte Tin on Solder Tails, Both over 127 um Min Nickel Shell: 2-5 um Min Bright Tin | 1.57 + 0.18 mm | Thru-hole | 4 | 11.7 x 5.76 mm |
| 31007 | Receptacle Assembly, Right Angle Flag, 4 Position | UL 94V-0 Rated Thermoplastic, Natural | Phosphor Bronze | Contacts: 0.076 um Min Gold over 0.076 um Min Palladium-Nickel on Mating Area, 3.8 um Min Matte Tin on Solder Tails, Both over 127 um Min Nickel Shell: 2-5 um Min Bright Tin | 1.57 + 0.18 mm | Thru-hole | 4 | 11.7 x 5.76 mm |
| 31007 | Receptacle Assembly, Right Angle Flag, 4 Position | UL 94V-0 Rated Thermoplastic, Black | Phosphor Bronze | Contacts: 0.076 um Min Gold over 0.076 um Min Palladium-Nickel on Mating Area, 3.8 um Min Matte Tin on Solder Tails, Both over 127 um Min Nickel Shell: 2-5 um Min Bright Tin | 1.57 + 0.18 mm | Thru-hole | 4 | 11.7 x 5.76 mm |
| Alternate Plating | Contact Plating Details | Shell Plating Details | Customer Drawing | Revision |
|---|---|---|---|---|
| 0.76 um Min Gold on Mating Area | 0.076 um Min Gold over 0.076 um Min Palladium-Nickel on Mating Area, 3.8 um Min Matte Tin on Solder Tails, Both over 127 um Min Nickel | 2-5 um Min Bright Tin | 307-7 (311) | D |
| 0.76 um Min Gold on Mating Area | 0.076 um Min Gold over 0.076 um Min Palladium-Nickel on Mating Area, 3.8 um Min Matte Tin on Solder Tails, Both over 127 um Min Nickel | 2-5 um Min Bright Tin | ECR-17-010213 | D |
