This specification details the MICRO 6.4JB product from Shenzhen Shouhan Technology Co., Ltd. It outlines material composition, operating conditions, and comprehensive electrical, mechanical, and environmental performance standards. Designed for reliable connectivity, this product is suitable for various applications requiring precise electrical and mechanical integrity.
| Part No. | Material Code | Material Details | Operating Current | Rated Voltage | Operating Temperature | Contact Resistance | Insulation Resistance | Dielectric Strength | Insertion Force | Extraction Force | Retention Force | Durability (Cycles) | Vibration Resistance | Solderability | High Temperature Resistance | Low Temperature Resistance | Humidity Resistance | Corrosion Resistance | Soldering Resistance |
| MICRO 6.4JB | MICRO 6.4JB | Plastic: LCP UL94V-0 Contact Terminal: C5191R-H, Nickel base, Gold plated contact area 1 Shell: C2680R-H, Nickel base shell plating 50, NI plating 80 | 1.0 Ampere | 30V | -30+80 | 50m MAX (at low power current) | 100M MIN (between adjacent contact pins) | 100V DC / 100V AC for 1 minute (0.5mA) | 0.5mA | 0.3 kgf MIN (with wire end) | 35N MAX | 3000 cycles (600 cycles/hour) | 1.5mm amplitude, 10Hz-55Hz-10Hz cycle, 2 hours per X/Y/Z direction | 95% tin coverage (immersed in 2355 tin bath for 50.5 seconds) | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN (after 96 hours at 85, 3 hours at room temp) | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN (after 96 hours at -40, 3 hours at room temp) | Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN (after 120 hours at 402, 90-95% RH) | Appearance: No obvious corrosion; Contact Resistance: 50m MAX (after 12 hours salt spray at 5% concentration, 352, 1 hour at room temp) | Appearance: No obvious discoloration/bubbling; Smooth solder foot wetting (refer to recommended reflow curve) |
