This product features high-temperature thermoplastic housing, high-grade copper alloy contact terminals, and stainless steel for its metallic shell, inner ground cover shell, and mid plate. It is designed for robust electrical and mechanical performance.
High temperature thermoplastic
High Grade Copper Alloy
Stainless Steel
Stainless Steel
Stainless Steel
| Area | Underplating | Contact Plating | Solder Area |
|---|---|---|---|
| Data Contact | 50" Min. Nickel | 14" Gold | 804" Matte Tin |
| Metallic Shell | 50" Min. Nickel | ||
| Cover Shell | B0p Min. Nickel | ||
| Inner Ground Cover Shell | 50" Min. Nickel |
| Parameter | Value |
|---|---|
| Voltage Rating | 20V DC |
| Current Rating | Ybus pins collectively 5.00A, GND pins collectively 6.25A, 85 pin 1.25A, Other pins 0.25A per pin |
| Contact Resistance | 40m Max. |
| Insulation Resistance | 100 M MIN. |
| Dielectric Withstanding Voltage | 100V AC/Minute |
| Parameter | Value |
|---|---|
| Durability | 10,000 cycles |
| Mating Force | 5 to 20N |
| Unmating Force | 8 to 20N (post test) |
