This USB Type B Micro Profile receptacle is designed for surface mount applications, featuring a reverse right-angle orientation and a mid-mount PCB location. It offers a single port with a 2.0 version USB interface and an integral locking latch for secure connections. The connector is supplied on tape and reel for automated assembly processes.
| Feature | Specification |
|---|---|
| Part Number | 2134441-2 |
| USB Connector Type | B |
| USB Version | 2.0 |
| Connector Profile | Micro |
| Number of Ports | 1 |
| Connector & Housing Type | Receptacle |
| Connector System | Cable-to-Board |
| Terminates To | Printed Circuit Board |
| Product Type Features | Integral Locking Latch |
| Body Features | Offset .88 mm |
| Shell Plating Finish | Matte |
| Shell Plating Material | Tin over Nickel |
| Contact Current Rating (Max) | 1.8 A |
| Contact Mating Area Plating Material | Gold |
| Contact Mating Area Plating Thickness | .76 m [29.52 in] |
| Termination Method to Printed Circuit Board | Surface Mount |
| Locking Feature | Without |
| Locating Posts | Without |
| PCB Mount Location | Mid Mount |
| PCB Mount Retention Type | Hold-Down |
| Connector Mounting Type | Board Mount |
| Body Orientation | Reverse Right Angle |
| Centerline (Pitch) | .65 mm [.025 in] |
| Housing Material | Thermoplastic |
| Tail Length | .7 mm [.028 in] |
| PCB Thickness (Recommended) | .8 1. mm [.031 .039 in] |
| Soldering Temperature (Max) | 260 C [500 F] |
| Mating Cycles (Max) | 10000 |
| Operating Temperature Range | -30 85 C [-22 185 F] |
| Assembly Process Feature | Without Pick and Place Cover |
| Circuit Application | Power & Signal |
| Moisture Sensitivity Level | 1 |
| UL Flammability Rating | UL 94V-0 |
| Packaging Quantity | 1000 |
| Reverse Type | Reverse Type |
| EU RoHS Directive | 2011/65/EU Compliant |
| EU ELV Directive | 2000/53/EC Compliant |
| China RoHS 2 Directive | MIIT Order No 32, 2016 |
| EU REACH Regulation | Current ECHA Candidate List: JUL 2021 (219), Candidate List Declared Against: JUL 2019 (201) |
| SVHC > Threshold | Not Yet Reviewed |
| Halogen Content | Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free |
| Solder Process Capability | Reflow solder capable to 260C |
