This product features a thermoplastic housing, UL 94V-0 rated and black in color. It is designed for SMT or DIP applications, with specific plating options for the contact and soldering areas. The housing is engineered to withstand high temperatures during reflow processes and meets European Union directives and other country regulations. Refer to GS-22-008 for detailed regulatory information.
| Specification | Details |
|---|---|
| Housing Material | Thermoplastic, UL 94V-0 rated |
| Contact Plating | 30u" MIN. Gold plating on contact area. Nickel 80u" MIN. plated over all. |
| Soldering Area Plating | 100u" MIN. Pure Matte Tin plated in soldering area. |
| Shell Material | Copper Alloy |
| Housing Temperature Resistance | Withstands exposure to 260 degrees C peak temperature for 10 seconds in an IR reflow application. |
| Product Specification Document | GS-12-174 |
| Packaging Specification Document | GS-14-873 |
| SMT Type | See Page 2 |
| DIP Type | See Page 1 |
| Lead Free Option | LF |
